IPC-A-610 is invaluable for all inspectors, operators and trainers.
Major topics include flex attachment, board-in-board, part-on-part, both lead-free and tin-lead criteria, component orientation and soldering criteria for through hole, SMT, cleaning, marking, coating and laminate requirements. Additionally, wherever possible statements were modified to make readability easier and to enhance understanding - all without eliminating any requirements. This revision includes two new SMT termination styles, as well as changes in plated-through hole fill and BGA void criteria. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. IPC-A-610 is the most widely used electronics assembly standard in the world.
